INTERTECH 2013 announces Call for Papers.
INTERTECH 2013 announces Call for Papers. We are now accepting abstracts through January 1, 2013 and these can be submitted on-line at: www.intertechconference.com. This international stage is an exceptional opportunity to distinguish your company through scientific research or innovative manufacturing processes.
INTERTECH 2013 is the featured Biennial International Conference dedicated to technological advancements and application development with an emphasis on increased productivity and performance using industrial diamond, cubic boron nitride, CVD diamond, polycrystallines and related materials classified as superabrasives. INTERTECH is scheduled for May 6 through May 8, 2013 at The Hyatt Regency Inner Harbor in Baltimore Maryland USA.
In 2013 the INTERTECH conference will have a major focus on the Aerospace and Defense industries while still providing exceptional coverage on new developments and applications in all other industries. The reason for this focus is the expanded use of exotic materials used in the manufacturing processes for aircraft and defense systems. These materials like superalloys, titanium, ceramics, high silicon aluminum and composites are very light and strong but due to their composition are extremely difficult to machine and grind when fabricating parts and components. In order to maintain high productivity and cost effective manufacturing operations, superabrasives are critical for success. The characteristics and properties of superabrasives allow for more precision, less scrap and no metallurgical damage on the finished parts. These results are extremely important in all industries, but crucial in the aerospace industry.
INTERTECH is designed to provide a blend of commercial and technical topics and serve as a global "meeting of the minds" for technologists and business leaders. Discover and share the most significant product innovations and new application developments in superabrasive technology for Aerospace and other major industries!
Put INTERTECH 2013 on your calendar today. Come join us for one of the most impressive and educational conferences you can attend… You can now submit an abstract at www.intertechconference.com to get on the program.
For specific details and information visit: www.intertechconference.com Questions? Call, write or email:
Terry M. Kane, INTERTECH 2013 Chairman
Executive Director, Industrial Diamond Association
Editor, Finer Points Magazine
P.O. Box 29460 Columbus, Ohio 43229 USA
Tel: (614) 797-2265
Fax: (614) 797-2264