9/9/10 – Dow Launches Polishing Products at SEMICON Taiwan 2010
9 September 2010
For chemical mechanical planarization (CMP) applications in the semiconductor manufacturing industry Dow Electronic Materials has launched two new CMP polishing pads as well as a novel “fumed-like” colloidal silica slurry. CMP remains one of the most complex, yet critical, process steps, with seemingly never-ending demands for new consumables that enable polishing increasingly diverse substrates and delicate structures.
The VISIONPAD™ 6000 and the VISIONPAD™ 5200 CMP Polishing pads are application-specific technology improvements for polishing applications at advanced nodes and looking to improve productivity at existing nodes. These high-performing polishing pads offer the right pad for specific CMP applications and can contribute to a reduction in consumable cost. The KLEBOSOL® II 1630 is a high-performing slurry with a low consumable cost and offers an alternative to traditional approaches to CMP. This dilutable slurry was designed using the colloidal and fumed silica slurries’ best attributes and offers process stability with low defect levels.
“Dow’s VISIONPAD™ polishing pad series offers the industry an unparalleled CMP platform specifically designed for current and next-generation manufacturing,” said Austin Chen, South Asia Regional General Manager for Dow Electronic Materials. “Our innovative R&D drove the development of the VISIONPAD™ platform, which gives us the ability to offer the right pad for specific CMP applications. These VISIONPAD™ polishing pads are higher-performing and allow for reduced consumable costs.”
VISIONPAD™ 6000 polishing pads deliver leading-edge technology designed specifically to improve defectivity and dishing for inter-layer dielectrics (ILD) and Copper (Cu) bulk applications. VISIONPAD™ 6000 polishing pads are engineered with a low-defect, low-hardness polymer chemistry and optimized pore size, which deliver improved defectivity and dishing and can exceed the removal rates of the IC1000™ polishing pads. In customer testing VISIONPAD™ 6000 demonstrated a 50 to 60 percent reduction in scratch defects, a 35 percent reduction in dishing and equivalent wafer non-uniformity to the IC1000™ polishing pads.
VISIONPAD™ 5200 polishing pads offer next-generation technology that achieves a high removal rate for Tungsten (W), ILD and Cu bulk processes. VISIONPAD™ 5200 polishing pads implement unique polymer chemistry and higher pad porosity that achieve a 10 to 30 percent increase in removal rate for W, ILD and Cu Bulk applications. This increased removal rate allows the customer to reduce polishing times and slurry consumption to significantly lower CMP cost of consumables. VISIONPAD™ 5200 polishing pads also offer a 10 to 20 percent reduction in defectivity in W and Cu applications, and improved dishing and erosion in W applications over Dow’s standard IC1000™ polishing pads.
KLEBOSOL® II 1630 Slurry, an advanced, dilutable slurry that combines the best attributes of colloidal and fumed silica slurries. Developed for leading-edge semiconductor manufacturing, the KLEBOSOL® slurry offers a high-performance, low cost of consumables alternative for CMP.
“KLEBOSOL® colloidal silica slurries provide excellent process stability with low defect levels,” said Asa Yamada, global slurry marketing director for Dow Electronic Materials. “We are now driving to lower point-of-use (POU) solids levels to improve end user cost of consumables. This new generation of KLEBOSOL® slurries now offers the performance benefits of colloidal silica with the planarization and dilution capabilities typically associated with fumed silicas. We’ve seen strong interest in this new slurry, with multiple adoptions in high volume manufacturing.”
The KLEBOSOL® II 1630 slurry is formulated with elongated fractal colloidal silica particles. It combines the high stability and ease-of-handling properties of colloidal silica with a new morphology that provides fumed-like particle planarization and allows for dilution. This makes KLEBOSOL® II 1630 highly cost competitive while maintaining the performance characteristics of colloidal silica slurries, including excellent removal rate stability, low defectivity, high planarization and tight process control. The KLEBOSOL® II 1630 slurry offers lower POU solids levels with a 0.3 micron POU filtration capability. It is easy-to-handle and resistant to agglomerate formation under high shear conditions. Additionally, compared to fumed silica, it can significantly extend pad life as end users are able to use less aggressive pad conditioners due to the colloidal silica’s low impact on pad surface asperities.
™Trademarks of The Dow Chemical Company (“Dow”) or an affiliated company of Dow and Klebosol® is a registered trademark of AZ Electronic Materials