Wafer polishing, also known as Chemical Mechanical Polishing (CMP), is a crucial process in semiconductor manufacturing that ensures the smoothness and flatness of wafer surfaces. This comprehensive guide explores the importance of wafer polishing, detailing each step from slicing and lapping to the final polishing phase.

Introduction Lapping films have become increasingly popular in various industries for achieving ultra-fine finishes on materials. These films are essential for precision polishing, ensuring that